Partnership
Joint solution with proven, industry leader to accelerate architecture and software development for AI-ready, next-generation automotive SoCs for ADAS and IVI applications.
SiMa.ai in Automotive
Physical AI Built for the Road Ahead.
SiMa.ai brings next-generation Physical AI to automotive, enabling ADAS systems, in-vehicle infotainment with conversational assists, and delivering best-in-class performance-per-watt at the edge.
Customer and Partner Stories
Applications
ADAS — Advanced Driver Assistance Systems
IVI — In-Vehicle Infotainment
Predictive Maintenance and Smart Diagnostics
Use Cases and Demos
Real-world automotive AI capabilities powered by on-device inference.
ADAS: Perception Enrichment Using GenAI
How It Works
SiMa.ai's MLSoC Modalix runs high-performance CNN and transformer models for real-time environmental perception — fusing radar, camera, and LiDAR inputs with GenAI augmentation for richer scene understanding.
Key Benefits
- Real-time object detection and scene understanding at the edge
- Sensor fusion across all modalities with low latency
- Application of latest GenAI technology for perception enrichment
Why Customers Choose SiMa.ai for Automotive
Purpose-built silicon and software for next-generation vehicle architectures — from ADAS to in-cabin intelligence.
On-Edge Conversational AI
Low-latency LLM, VLM, and VLA inference on-device — consistent performance without cloud dependency, with better security and reduced costs.
Best-in-Class Performance per Watt
Significant cost savings at the ECU level. Ultra-low power enables fanless designs and easy integration into existing vehicle architectures.
Privacy and Security by Design
Local inferencing keeps sensitive data on-device. Consistent performance independent of connectivity — even in tunnels and remote areas.
Push-Button Deployment
Palette software suite dramatically reduces development time and cost. Fast introduction into existing E/E architectures with cross-platform compatibility.
Automotive Product Portfolio
One Physical AI platform, three deployment form factors — from stand-alone AI-Boxes and companion SOCs to future ML chiplets.
GenAI ECU
AI Box
- SOP: 2028
- USB 2 & 3 and power interface
- Ambient temp -40°C to 65°C (fanless design)
- Target dimensions: 110 × 80 × 30 mm
MLSoC Integration
Companion Integration
- SOP 2028
- Modalix companion chip in IVI ECU
- SOP 2030
- GEN3-based performance upgrade
Chiplet
Chiplet Integration
- SOP: 2032
- SiMa.ai ML chiplet
- Base performance: 200 TOPS
- Scalable ML performance with multi-chiplet approach